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National Hotline : 0755-27536484 CN
TECHNOLOGY CAPABILITIES | ||||
Layer Count[MAX]: | 18 L | |||
Min. Line Width/Space: | 0.076/0.076mm | |||
Min.Drilled Hole Size-Mechanical: | 0.2mm | |||
Min.Drilled Hole Size-Laser: | 0.1mm | |||
Max. Copper Thickness: | 6 OZ | |||
Layer To Layer Registration Tolerance : | ±0.076mm | |||
Max.Finished Board Thickness : | 5.0mm | |||
Min.Finished Board Thickness : | 0.4mm | |||
Min.Core Dielectric Thickness : | 0.076mm | |||
Max. Drill Aspect Ratio : | 10:01 | |||
Press Fit Hole Tolerance : | ±0.05mm | |||
Min.Impedance Tolerance : | ±10% | |||
HDI Stack Up : | 1+N+1 | |||
Controlled Depth Drilling Tolerance : | ±0.15mm | |||
Max Production Panel Size : | 24.5"*32" | |||
Via In PAD : | YES | |||
BGA Pitch(with trace) : | 0.5mm | |||
Soldermask Registration : | ±0.038mm | |||
Min.Solder Dam : | 0.064mm |
8th Floor, Block B, Building 6, Zhonggang Plaza, Convention Bay, Fuyong International Convention and Exhibition Center, Bao'an District, Shenzhen